Yincae兴奋地宣布，我们已经开发了SMT 158D8，一种高热导导的底部填充毛细管和快速流动，并且易于重新修饰的液体环氧树脂。
SMT 158D8 is the world’s first (and only) commercially available diamond filled underfill. SMT 158D8 has a thermal conductivity of >6 W/mK, can flow into small gaps easily with no phase separation, high salt-moisture resistance, and excellent adhesion. Furthermore, the performance of the SMT 158D8 drop test has been improved by two orders of magnitude compared with that with the use of solder paste. The highlight of the SMT 158D8 is its ability to lower CPU (POP) temperatures by 10 °C.
This material can be used as a underfill for flip chip, chip scale package, ball grid array devices, package on package, and land grid array application. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. It is designed for high production and an environment where process speed and thermal dissipation are key concerns.
有关Yincae的SMT 158D8 Underfill的更多信息，或者要了解有关Yincae产品范围的更多信息，请给我们发送电子邮件：[email protected]。
Source:https://www.yincae.com/