2004年8月6日
内在的半导体是一家私有带盖材料的私人制造商，今天宣布已签订了获得Bandgap Technologies，I亚博网站下载nc。（哥伦比亚，南卡罗来纳州）的权威协议。Bandgap Technologies是国防承包商，也是硅碳化物（SIC）晶圆产品的制造商。
内在总裁兼首席执行官Cengiz Balkas博士表示：“ BandGap的战略性获取允许内在的固有性，可以更快地提供各种SIC WAFER产品。最近，我们在内部生产的Wafers上引入了最先进的外在服务。这项交易。这项交易。这项交易。provides Intrinsic with the added production capacity to serve the expanding SiC and GaN technology markets. Furthermore, the combined companies will accelerate SiC development cycle times as well as improve upon Intrinsic’s distinct intellectual property position."
"The unique and highly efficient SiC crystal growth and wafering technologies developed at Bandgap are an excellent fit with Intrinsic’s business strategy. Our team is very pleased to be joining Intrinsic Semiconductor and look forward to continuing our efforts in developing the industry’s highest-quality, largest diameter SiC crystals," said Dr. Yuri Khlebnikov, President of Bandgap Technologies.
两家公司都在努力迅速合并。预计联合运营将在2004年8月底完全整合。
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